*恭喜浙江省农业科学院俞老师在SCI期刊 Environmental Science and Pollution Research(IF:2.914)上成功发表
*恭喜西安理工大学张老师,环境水利专业,文章成功发表在SCI期刊Environmental Science and Pollution Research上,IF2.914
*恭喜山东交通学院谢老师在SCI期刊APPLIED SURFACE SCIENCE(IF5.15)上成功发表
*恭喜华中科技大学黄老师在SCI期刊 ACS Applied Materials & Interfaces(IF8.456)上成功发表
*恭喜中南大学湘雅医院黄医生在Frontiers in Oncology(IF 4.137)上成功发表
*恭喜复旦大学辛博士在SCI期刊 FEBS LETTERS(IF2.675)上成功发表
*恭喜中南大学陈博士在THIN-WALLED STRUCTURESSCI期刊(IF3.488)上成功发表
*恭喜湖南工学院郭老师在SCI期刊SIMULATION MODELLING PRACTICE AND THEORY(IF2.42)上成功发表
*恭喜东华大学闫老师在SCI期刊Advanced Functional Materials(IF 15.621)上成功发表
*恭喜安徽医科大学肖老师在SCI期刊BMC CELL BIOLOGY(IF 3.485)上成功发表
*恭喜四川大学华西医院谢医生在SCI期刊European Heart Journal: Acute Cardiovascular Care(IF 3.734)上成功发表

0591-83301811

周一~周日, 8:00 - 23:00

13107667616

周一~周日, 8:00 - 23:00

service@editideas.cn

随时欢迎您的来信!

2021年最新SCI期刊影响因子查询系统

期刊名称:
ISSN:
期刊研究方向:
IF范围:
中科院分区:
SCI/SCIE:
是否OA期刊:
排列方式:

MICROELECTRONICS RELIABILITY 期刊详细信息

基本信息
期刊名称 MICROELECTRONICS RELIABILITY
MICROELECTRONICS RELIABILITY
期刊ISSN 0026-2714
期刊官方网站 http://www.journals.elsevier.com/microelectronics-reliability/
是否OA
出版商 Elsevier Ltd
出版周期 Monthly
始发年份 1964
年文章数 526
最新影响因子 1.418(2021)
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技4区
PHYSICS, APPLIED 物理:应用4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 1.70 0.376 0.983
Materials Science
Surfaces, Coatings and Films
48 / 116 59%
Engineering
Safety, Risk, Reliability and Quality
54 / 154 64%
Physics and Astronomy
Atomic and Molecular Physics, and Optics
76 / 173 56%
Materials Science
Electronic, Optical and Magnetic Materials
95 / 225 57%
Physics and Astronomy
Condensed Matter Physics
168 / 397 57%
Engineering
Electrical and Electronic Engineering
248 / 661 62%
补充信息
自引率 19.70%
H-index 80
SCI收录状况 Science Citation Index Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0026-2714%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/mr/
收稿范围
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Additional regular features will include:
• Special issues devoted to significant international conferences, or to important developing topics
• Letters to the Editors
• Industrial news and updates
• Calendar of forthcoming events
• Book reviews
Microelectronics Reliability is an indispensable forum for the exchange of knowledge and experience between microelectronics reliability professionals from both academic and industrial environments, and all those associated in any way with a steadily growing microelectronics industry and its many fields of application.
收录体裁
Original research papers, introductory invited and reviews papers, and research notes.
投稿指南 https://www.elsevier.com/journals/microelectronics-reliability/0026-2714/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/microelectronics-reliability/0026-2714/guide-for-authors
编辑信息
近期成功发表案例展示